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IEC 60068-2-58:2015+AMD1:2017 CSV
Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)- 발행일 : 2017-07-28
- 발행기관 : IEC
상세정보
| 분야 | TC 91 : Electronics assembly technology |
|---|---|
| 적용범위 | IEC 60068-2-58:2015+A1:2017 outlines test Td, applicable to surface mounting devices (SMD). This standard provides procedures for determining the solderability and resistance to soldering heat of devices in applications using solder alloys, which are eutectic or near eutectic tin lead (Pb), or lead-free alloys. The procedures use either a solder bath or reflow method and are applicable only to specimens or products designed to withstand short term immersion in molten solder or limited exposure to reflow systems. The solder bath method is applicable to SMDs designed for flow soldering and SMDs designed for reflow soldering when the solder bath (dipping) method is appropriate. The reflow method is applicable to the SMD designed for reflow soldering, to determine the suitability of SMDs for reflow soldering and when the solder bath (dipping) method is not appropriate. This edition includes the following significant technical changes with respect to the previous edition: - the addition of Sn-Bi low temperature solder alloy; - the addition of several reflow test conditions in Table 7 - Resistance to soldering heat - Test conditions and severity, reflow method; - introduction of reflow test method for Test Td3: Dewetting and resistance to dissolution of metallization; - implementation of guidance for the choice of a test severity in Clause B.3. This consolidated version consists of the fourth edition (2015) and its amendment 1 (2017). Therefore, no need to order amendment in addition to this publication. |
| 국제분류(ICS)코드 |
31.190 : 전자 부품 조립품
19.040 : 환경 시험 |
| 페이지수 | 73 |
| Edition | 4.1 |
이력정보
| No. | 표준번호 | 표준명 | 발행일 | 상태 |
|---|---|---|---|---|
| 1 | IEC 60068-2-58:2015/AMD1:2017상세보기 | Amendment 1 - Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD) | 2017-07-28 | 표준 |
| 2 | IEC 60068-2-58:2015+AMD1:2017 CSV상세보기 | Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD) | 2017-07-28 | 표준 |
| 3 | IEC 60068-2-58:2015상세보기 | Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD) | 2015-03-27 | 표준 |
| 4 | IEC 60068-2-58:2004상세보기 | Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD) | 2004-07-15 | 구판 |
| 5 | IEC 60068-2-58:1999상세보기 | Environmental testing - Part 2-58: Tests - Test Td - Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD) | 1999-01-15 | 구판 |
| 6 | IEC 60068-2-58:1989상세보기 | Environmental testing. Part 2: Tests. Test Td: Solderability, resistance to dissolution of metallization and to soldering heat of Surface Mounting Devices (SMD) | 1989-08-15 | 구판 |
관련상품
- IEC 60068-2-3:1969 - Basic environmental testing procedures - Part 2-3: Tests - Test Ca: Damp heat, steady state
- IEC 60068-2-33:1971 - Environmental testing - Part 2: Tests. Guidance on change of temperature tests
- IEC 60068-2-34:1973 - Basic environmental testing procedures - Part 2: Tests. Test Fd: Random vibration wide band - General requirements
- IEC 60068-2-35:1973 - Basic environmental testing procedures - Part 2: Tests - Test Fda: Random vibration wide band - Reproducibility High
- IEC 60068-2-36:1973 - Basic environmental testing procedures - Part 2: Tests - Test Fdb: Random vibration wide band - Reproducibility Medium
다른 사람이 함께 구입한 상품
- IEC 60068-2-69:2017+AMD1:2019 CSV - Environmental testing - Part 2-69: Tests - Test Te/Tc: Solderability testing of electronic components and printed boards by the wetting balance (force measurement) method
- IEC 60068-2-7:1983 - Basic environmental testing procedures - Part 2-7: Tests - Test Ga and guidance: Acceleration, steady state
- IEC 60068-2-39:2015 - Environmental testing - Part 2-39: Tests - Tests and guidance: Combined temperature or temperature and humidity with low air pressure tests
- IEC 60068-2-52:2017 - Environmental testing - Part 2-52: Tests - Test Kb: Salt mist, cyclic (sodium chloride solution)
- IEC 60068-2-78:2012 - Environmental testing - Part 2-78: Tests - Test Cab: Damp heat, steady state
추천 상품
- IEC TS 63134:2020 - Active assisted living (AAL) use cases
- IEC 60034-5:2020 RLV - Rotating electrical machines - Part 5: Degrees of protection provided by the integral design of rotating electrical machines (IP code) - Classification
- KS B ISO TS 25740-1 - 에스컬레이터 및 무빙워크에 대한 안전요건 — 제1부: 세계공통 필수 안전요건(GESRs)
- KS B ISO TS 8100-21 - 승객 및 화물 운송용 엘리베이터 —제21부: 세계공통 필수안전요건(GESRs)을 충족하는 세계공통 안전 파라미터(GSPs)
- KS C IEC TS 62872 - 산업 시설과 스마트 그리드 사이의 산업 공정 측정, 제어 및 자동화 시스템 인터페이스
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