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IEC 60068-2-69:2007
Environmental testing - Part 2-69: Tests - Test Te: Solderability testing of electronic components for surface mounting devices (SMD) by the wetting balance method- 발행일 : 2007-05-09
- 발행기관 : IEC
- 대체표준 : IEC 60068-2-69:2017
상세정보
| 분야 | TC 91 : Electronics assembly technology |
|---|---|
| 적용범위 | IEC 60068-2-69:2007 outlines test Te, solder bath wetting balance method and solder globule wetting balance method, applicable for surface mounting devices. These methods determine quantitatively the solderability of terminations on surface mounting devices. IEC 60068-2-54 is also available for surface mounting devices and should be consulted if applicable. The procedures describe the solder bath wetting balance method and the solder globule wetting balance method and are both applicable to components with metallic terminations and metallized solder pads. This standard provides the standard procedures for solder alloys containing lead (Pb) and for lead-free solder alloys. This second edition cancels and replaces the first edition published in 1995 and constitutes a technical revision. The main changes from the previous edition are as follows: - Inclusion of lead-free alloy test conditions; - Inclusion of new fluxes for testing, reflecting development of fluxes that have happened in the industry in the past 20 years; - Inclusion of new component types, and updating test parameters for the whole component list. |
| 국제분류(ICS)코드 |
31.190 : 전자 부품 조립품
19.040 : 환경 시험 |
| 페이지수 | 50 |
| Edition | 2.0 |
이력정보
| No. | 표준번호 | 표준명 | 발행일 | 상태 |
|---|---|---|---|---|
| 1 | IEC 60068-2-69:2017/AMD1:2019상세보기 | Amendment 1 - Environmental testing - Part 2-69: Tests - Test Te/Tc: Solderability testing of electronic components and printed boards by the wetting balance (force measurement) method | 2019-06-19 | 표준 |
| 2 | IEC 60068-2-69:2017+AMD1:2019 CSV상세보기 | Environmental testing - Part 2-69: Tests - Test Te/Tc: Solderability testing of electronic components and printed boards by the wetting balance (force measurement) method | 2019-06-19 | 표준 |
| 3 | IEC 60068-2-69:2017/COR1:2018상세보기 | Corrigendum 1 - Environmental testing - Part 2-69: Tests - Test Te/Tc: Solderability testing of electronic components and printed boards by the wetting balance (force measurement) | 2018-01-24 | 표준 |
| 4 | IEC 60068-2-69:2017상세보기 | Environmental testing - Part 2-69: Tests - Test Te/Tc: Solderability testing of electronic components and printed boards by the wetting balance (force measurement) method | 2017-03-07 | 표준 |
| 5 | IEC 60068-2-69:2007상세보기 | Environmental testing - Part 2-69: Tests - Test Te: Solderability testing of electronic components for surface mounting devices (SMD) by the wetting balance method | 2007-05-09 | 구판 |
| 6 | IEC 60068-2-69:1995상세보기 | Environmental testing - Part 2: Tests - Test Te: Solderability testing of electronic components for surface mount technology by the wetting balance method | 1995-12-08 | 구판 |
관련상품
- IEC 60068-2-3:1969 - Basic environmental testing procedures - Part 2-3: Tests - Test Ca: Damp heat, steady state
- IEC 60068-2-33:1971 - Environmental testing - Part 2: Tests. Guidance on change of temperature tests
- IEC 60068-2-34:1973 - Basic environmental testing procedures - Part 2: Tests. Test Fd: Random vibration wide band - General requirements
- IEC 60068-2-35:1973 - Basic environmental testing procedures - Part 2: Tests - Test Fda: Random vibration wide band - Reproducibility High
- IEC 60068-2-36:1973 - Basic environmental testing procedures - Part 2: Tests - Test Fdb: Random vibration wide band - Reproducibility Medium
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