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    IEC 60068-2-69:2017

    Environmental testing - Part 2-69: Tests - Test Te/Tc: Solderability testing of electronic components and printed boards by the wetting balance (force measurement) method
    • 발행일 : 2017-03-07
    • 발행기관 : IEC
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상세정보

분야 TC 91 : Electronics assembly technology
적용범위 IEC 60068-2-69:2017 outlines test Te/Tc, the solder bath wetting balance method and the solder globule wetting balance method to determine, quantitatively, the solderability of the terminations. Data obtained by these methods are not intended to be used as absolute quantitative data for pass–fail purposes.
The procedures describe the solder bath wetting balance method and the solder globule wetting balance method. They are applicable to components and printed boards with metallic terminations and metallized solder pads.
This document provides the measurement procedures for solder alloys both with and without lead (Pb).
This edition includes the following significant technical changes with respect to the previous edition:
- integration of IEC 60068-2-54;
- inclusion of tests of printed boards;
- inclusion of new component types, and updating test parameters for the whole component list;
- inclusion of a new gauge R & R test protocol to ensure that the respective wetting balance equipment is correctly calibrated.
The contents of the corrigendum of January 2018 have been included in this copy.
국제분류(ICS)코드 31.190 : 전자 부품 조립품
19.040 : 환경 시험
페이지수 110
Edition 3.0

이력정보

No. 표준번호 표준명 발행일 상태
1 IEC 60068-2-69:2017/AMD1:2019상세보기 Amendment 1 - Environmental testing - Part 2-69: Tests - Test Te/Tc: Solderability testing of electronic components and printed boards by the wetting balance (force measurement) method 2019-06-19 표준
2 IEC 60068-2-69:2017+AMD1:2019 CSV상세보기 Environmental testing - Part 2-69: Tests - Test Te/Tc: Solderability testing of electronic components and printed boards by the wetting balance (force measurement) method 2019-06-19 표준
3 IEC 60068-2-69:2017/COR1:2018상세보기 Corrigendum 1 - Environmental testing - Part 2-69: Tests - Test Te/Tc: Solderability testing of electronic components and printed boards by the wetting balance (force measurement) 2018-01-24 표준
4 IEC 60068-2-69:2017상세보기 Environmental testing - Part 2-69: Tests - Test Te/Tc: Solderability testing of electronic components and printed boards by the wetting balance (force measurement) method 2017-03-07 표준
5 IEC 60068-2-69:2007상세보기 Environmental testing - Part 2-69: Tests - Test Te: Solderability testing of electronic components for surface mounting devices (SMD) by the wetting balance method 2007-05-09 구판
6 IEC 60068-2-69:1995상세보기 Environmental testing - Part 2: Tests - Test Te: Solderability testing of electronic components for surface mount technology by the wetting balance method 1995-12-08 구판

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