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    IEC 60664-3:2003+AMD1:2010 CSV

    Insulation coordination for equipment within low-voltage systems - Part 3: Use of coating, potting or moulding for protection against pollution
    • 발행일 : 2010-08-23
    • 발행기관 : IEC
    • 대체표준 : IEC 60664-3:2016
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상세정보

분야 TC 109 : Insulation co-ordination for low-voltage equipment
적용범위 IEC 60664-3:2003+A1:2010 applies to assemblies protected against pollution by the use of coating, potting or moulding, thus allowing a reduction of clearance and creepage distances as described in Part 1 or Part 5. This standard describes the requirements and test procedures for two methods of protection:
- type 1 protection improves the microenvironment of the parts under the protection;
- type 2 protection is considered to be similar to solid insulation.
This standard also applies to all kinds of protected printed boards, including the surface of inner layers of multi-layer boards, substrates and similarly protected assemblies. In the case of multi-layer printed boards, the distances through an inner layer are covered by the requirements for solid insulation in Part 1. This standard refers only to permanent protection. It does not cover assemblies that are subjected to mechanical adjustment or repair. The principles of this standard are applicable to functional, basic, supplementary and reinforced insulation. This consolidated version consists of the second edition (2003) and its amendment 1 (2010). Therefore, no need to order amendment in addition to this publication. The contents of the corrigendum of November 2010 have been included in this copy.
국제분류(ICS)코드 29.080.30 : 절연 시스템
페이지수 49
Edition 2.1

이력정보

No. 표준번호 표준명 발행일 상태
1 IEC 60664-3:2016 RLV상세보기 Insulation coordination for equipment within low-voltage systems - Part 3: Use of coating, potting or moulding for protection against pollution 2016-11-04 표준
2 IEC 60664-3:2016상세보기 Insulation coordination for equipment within low-voltage systems - Part 3: Use of coating, potting or moulding for protection against pollution 2016-11-04 표준
3 IEC 60664-3:2003/AMD1:2010/COR1:2010상세보기 Corrigendum 1 to amendment 1 - Insulation coordination for equipment within low-voltage systems - Part 3: Use of coating, potting or moulding for protection against pollution 2010-11-29 구판
4 IEC 60664-3:2003+AMD1:2010 CSV상세보기 Insulation coordination for equipment within low-voltage systems - Part 3: Use of coating, potting or moulding for protection against pollution 2010-08-23 구판
5 IEC 60664-3:2003/AMD1:2010상세보기 Amendment 1 - Insulation coordination for equipment within low-voltage systems - Part 3: Use of coating, potting or moulding for protection against pollution 2010-05-19 구판
6 IEC 60664-3:2003상세보기 Insulation coordination for equipment within low-voltage systems - Part 3: Use of coating, potting or moulding for protection against pollution 2003-02-17 구판
7 IEC 60664-3:1992상세보기 Insulation coordination for equipment within low-voltage systems - Part 3: Use of coatings to achieve insulation coordination of printed board assemblies 1992-10-13 구판

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